- Technical Committee -


Radu Vasiu, Politehnica University of Timisoara, Romania
Wai Lok Woo, Northumbria University, UK
Loc Nguyen, Sunflower Soft Company, Vietnam
Chuan Zhang, Beijing Institute of Technology, China
Feiran Huang, Jinan University, China
Gengshen Wu, City University of Macau, China
Hemn Abdalla, Wenzhou-Kean University, China
Hemn Barzan Abdalla, Wenzhou-Kean University, China
Jianhong Zhang, North China University of Technology, China
Jianhua Yang, University of Science and Technology Beijing, China
Jie Zhang, Xi’an Jiaotong-Liverpool University, China
Mehdi Gheisari, Islamic Azad University, Iran and Shenzhen BKD Co.LTD, China
Yew Kee WONG Eric, Hong Kong Chu Hai College, China
Yijun Bei, Zhejiang University, China
Yong Zhao, Sichuan University, China
Zheyi Chen, Fuzhou University, China
Zhihua Wu, Liming Vocational University, China